BESI - BE Semiconductor Industries NV

BE Semiconductor Industries NV is a leading provider of semiconductor assembly equipment, serving the global semiconductor and electronics industries. With operations spanning across China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, and Europe, the company has established a strong presence in the market.

The company's product portfolio is divided into three segments: Die Attach, Packaging, and Plating. Its die attach equipment offerings include single chip, multi-chip, and multi-module solutions, as well as flip chip, thermal compression bonding, and fan-out wafer level packaging technologies. Additionally, the company provides hybrid and embedded bridge die bonding, and die sorting systems.

In the packaging segment, BE Semiconductor Industries NV offers conventional, ultra-thin, and wafer level molding solutions, along with trim and form, and singulation systems. The company's plating equipment range includes tin, copper, and precious metal plating systems, as well as solar plating systems, and related process chemicals.

BE Semiconductor Industries NV also provides tooling, conversion kits, spare parts, and other services to its customers. The company's products are marketed under four principal brand names: Datacon, Esec, Fico, and Meco. Its customer base consists of multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.

Founded in 1995, BE Semiconductor Industries NV is headquartered in Duiven, the Netherlands, and has established itself as a trusted partner for companies operating in the semiconductor and electronics industries. With a strong online presence, the company can be reached through its website at https://www.besi.com.